线路板(PCB)制作流程术语中英文对照
栏目:公司新闻 发布时间:2022-10-26 00:21
本文摘要:流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油) --镀金--喷锡--成型--开短路测试--终检--雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting) a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3

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流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油) --镀金--喷锡--成型--开短路测试--终检--雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting) a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔(2nd Drilling) b-4 雷射钻孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处置惩罚(Pretreatment) c-2 压膜(Dry Film Lamination) c-3 曝光(Exposure) c-4 显影(Developing) c-5 蚀铜(Etching) c-6 去膜(Stripping) c-7 初检( Touch-up) c-8 化学前处置惩罚,化学研磨( Chemical Milling ) c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing ) c-11 去膜(Stripping ) Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment) d-2 微蚀(Microetching) d-3 铆钉组合(eyelet ) d-4 叠板(Lay up) d-5 压合(Lamination) d-6 后处置惩罚(Post Treatment) d-7 黑氧化( Black Oxide Removal ) d-8 铣靶(spot face) d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating) f-3 低于1 mil ( Less than 1 mil Thickness ) f-4 高于1 mil ( More than 1 mil Thickness) f-5 砂带研磨(Belt Sanding) f-6 剥锡铅( Tin-Lead Stripping) f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print ) g-2 预烤(Precure) g-3 外貌刷磨(Scrub) g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side) h-2 S面印刷(Printing Bottom Side) h-3 静电喷涂(Spray Coating) h-4 前处置惩罚(Pretreatment) h-5 预烤(Precure) h-6 曝光(Exposure) h-7 显影(Develop) h-8 后烘烤(Postcure) h-9 UV烘烤(UV Cure) h-10 文字印刷( Printing of Legend ) h-11 喷砂( Pumice)(Wet Blasting) h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger ) i-2 电镀软金(Soft Ni/Au Plating) i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡( Vertical Hot Air Solder Leveling) j-3 超级焊锡(Super Solder ) j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling) k-2 模具冲(Punch) k-3 板面清洗烘烤(Cleaning & Backing) k-4 V型槽( V-Cut)(V-Scoring) k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)l-1 AOI 光学检查( AOI Inspection) l-2 VRS 目检(Verified & Repaired) l-3 泛用型治具测试(Universal Tester) l-4 专用治具测试(Dedicated Tester) l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove) m-2 X-OUT 印刷(X-Out Marking) m-3 包装及出货(Packing & shipping) m-4 目检( Visual Inspection) m-5 清洗及烘烤( Final Clean & Baking) m-6 护铜剂(ENTEK Cu-106A)(OSP) m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热打击试验(Thermal cycling Testing) m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole) N-2 雷射曝光对位孔(Laser Ablation Registration Hole) N-3 雷射Mask制作(Laser Mask) N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除胶渣(Desmear) N-8 微蚀(Microetching )
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